1. |
MARKET FORECASTS |
1.1. |
Ten-year market forecasts in USD for all conductive inks and pastes split by 30 application areas |
1.2. |
Ten-year market forecasts in USD for all conductive inks and pastes split by application. PV excluded. |
1.3. |
Ten-year market forecasts in tonnes for all conductive inks and pastes split by application. PV included. |
1.4. |
Ten-year market forecasts in tonnes for all conductive inks and pastes split by application. PV excluded. |
1.5. |
Ten-year market forecast for micron-sized (non nano) conductive inks and pastes split by application |
1.6. |
Ten-year market forecasts for silver nanoparticle conductive inks and pastes split by application |
1.7. |
Ten-year market forecasts printed sensors (piezoresistive, glucose, capacitive, touch edge electrode, ITO replacement, etc.) |
1.8. |
Ten-year market forecasts printed sensors (In-Mold Electronics) |
1.9. |
Ten-year market forecasts automotive (exterior, seat heaters, occupancy sensors, FHE, etc.) |
1.10. |
Ten-year market forecasts RFID and flexible hybrid electronics |
1.11. |
Ten-year market forecasts for power electronic in electronics vehicles (sintered Ag, nanoAg and Cu) |
1.12. |
Ten-year market forecasts for conformal metallization (aerosol and package-level conformal EMI coating) |
1.13. |
Ten-year market forecasts for other (3D printed electronics, desktop printing, professional PCB printing, wearable e-readers, etc.) |
2. |
GENERAL TECHNOLOGY INTRODUCTION |
2.1. |
Powder morphologies in conductive paste |
2.2. |
How cured conductive lines appear |
2.3. |
Changing the morphology of particles: from spherical to flat flakes |
2.4. |
Elements of a paste: resin, solvent, milling, etc. |
2.5. |
Curing categories: PTF vs firing type |
2.6. |
Firing type paste: key properties and considerations |
2.7. |
Firing type paste: key properties and considerations |
2.8. |
Performance level of fired and cured traditional pastes/inks across various applications |
2.9. |
Typical oven and drying towers used in curing |
2.10. |
Value chain for conductive pastes |
3. |
SILVER NANOPARTICLE INKS |
3.1. |
Silver nanoparticle inks: key value propositions |
3.2. |
Silver nanoparticle inks: higher conductivity |
3.3. |
Silver nanoparticles: getting more with less |
3.4. |
Performance of Ag nano inks and comparison with traditional inks |
3.5. |
Ag nanoparticle inks: do they really cure fast and at lower temperatures? |
3.6. |
Ag nanoparticle inks: why the curing takes time |
3.7. |
Ag nanoparticle inks: roadmap towards reducing curing temperature |
3.8. |
Other benefits of nanoparticle inks |
3.9. |
Price competitiveness of silver nanoparticles |
3.10. |
Performance and typical characteristics of various silver nanoparticle inks on the market |
3.11. |
Value chain of silver nanoparticle inks |
3.12. |
Silver nanoparticle production methods |
3.13. |
Silver nanoparticle production methods |
3.14. |
Benchmarking different nanoparticle production processes |
4. |
PARTICLE FREE INKS |
4.1. |
Particle free conductive inks and pastes |
5. |
COPPER INKS |
5.1. |
Copper inks: how silver prices drove innovation |
5.2. |
List of companies supplying or researching copper or silver alloy powders, inks or pastes |
5.3. |
Methods of preventing copper oxidisation |
5.4. |
Toyobo's Superheated steam: principle, status, merits and disadvantages |
5.5. |
Toyobo's Superheated steam: potential application |
5.6. |
Hitachi's Reactive agent metallization: principle, status, merits and disadvantages |
5.7. |
Rapid photosintering: low-cost materials combined with rapid sintering |
5.8. |
Photosintering: temperature profile as a function of thickness |
5.9. |
Ag and even solder can also be photosintered |
5.10. |
Photosintering: machines come in a variety of shapes and sizes |
5.11. |
Air curable copper pastes |
5.12. |
NOF: Screen printable air-curable copper paste |
5.13. |
Copprint: Copper inks with in-situ oxidation prevention |
5.14. |
Asahi Kasei: Reducing cuprous oxide by sintering |
5.15. |
Pricing strategy and performance of copper inks and pastes |
5.16. |
Performance and key characteristics of copper inks and pastes offered by different companies |
5.17. |
Copper oxide nanoparticles |
5.18. |
Silver-Coated Copper |
6. |
NON-SOLUTION BASED ADDITIVE PROCESSES |
6.1. |
Additive non-solution deposition of metals |
7. |
PHOTOVOLTAICS: MARKET DYNAMICS, TRENDS, AND FORECAST |
7.1. |
Conductive inks: everything is changing |
7.2. |
Photovoltaic market: overview of price and cumulative installation |
7.3. |
Photovoltaic markets: the massive loans that drove Chinese expansion and eventual market consolidation |
7.4. |
Photovoltaics: historical price evolution of silicon PV |
7.5. |
Price learning curve of c-Si and thin film PV technologies |
7.6. |
Latest PV prices at wafer, cell, and module levels |
7.7. |
Photovoltaic market: overview of price and cumulative installation |
7.8. |
Photovoltaics: evolution of production share by region |
7.9. |
Photovoltaics: global annual production by region |
7.10. |
Photovoltaics: top ten players |
7.11. |
Photovoltaics: evolution of market share of thin film PV technologies |
7.12. |
Photovoltaics: eroding margins and market valuations |
7.13. |
The return of the boom and bust to the PV sector? |
7.14. |
Photovoltaics: global installation and forecasts showing market is to breach 100GW/yr |
7.15. |
Massive Chinese investments had buoyed the market |
7.16. |
China takes markets to new heights but have the changes in FiTs finally cooled it down? |
7.17. |
Did the market cool in 2019 or grow rapidly? |
8. |
CONDUCTIVE PASTES IN PHOTOVOLTAICS |
8.1. |
Conductive pastes in the PV sectors: introduction |
8.2. |
Conductive pastes in the PV sectors: firing |
8.3. |
Conductive ink: major cost driver for PVs |
8.4. |
Reducing silver content per wafer: industry consensus |
8.5. |
Reducing silver content per wafer: our projection |
8.6. |
Reducing silver content per wafer: ink innovations |
8.7. |
Photovoltaics: expected market share evolution between plating and screen printing of electrodes |
8.8. |
Photovoltaics: roadmap towards ever thinner wafers |
8.9. |
Photovoltaics: market share forecast for different metallization technologies |
8.10. |
Silicon inks: made redundant before seeing daylight? |
8.11. |
Copper metallization in solar cells |
8.12. |
Trends and changes in solar cell architecture |
8.13. |
Photovoltaics: evolution of different silicon solar cell architectures |
8.14. |
Photovoltaics market dynamic: everything is changing |
8.15. |
Silver nanoparticles are finally adopted in the thin film photovoltaic business? |
8.16. |
PV and heater: digital printing comes of age? |
9. |
ORGANIC PHOTOVOLTAICS |
9.1. |
What is an OPV? |
9.2. |
Typical device architectures |
9.3. |
R2R solution vs R2R evaporation |
9.4. |
Progress in solution processing so far |
9.5. |
OPV products and prototypes |
9.6. |
OPV installations |
9.7. |
Latest progress update |
9.8. |
Where is silver used in printed OPVs? |
10. |
AUTOMOTIVE |
10.1.1. |
Automotive industry: a large and growing consumer of conductive ink/paste |
10.1.2. |
Automotive de-foggers: established business? |
10.1.3. |
Automotive de-foggers: transition from glass to PC |
10.1.4. |
Printed on-glass heater: digital printing comes of age? |
10.1.5. |
Laser transfer printing as a new process? |
10.1.6. |
Metal mesh transparent conductors as replacement for printed heaters? |
10.1.7. |
Carbon nanotube transparent conductors as replacement for printed heaters? |
10.1.8. |
Growing need for 3D shaped transparent heater in ADAS and autonomous driving perception sensors such as camera and lidars |
10.2. |
Automotive Seat Heater |
10.2.1. |
Automotive seat heaters |
10.2.2. |
Automotive seat heaters: PTC inks |
10.3. |
Occupancy and other sensors |
10.3.1. |
Automotive occupancy and seat belt alarm sensors |
10.3.2. |
Electric vehicle battery heaters |
10.3.3. |
Electric vehicle battery heaters (GGI/e2ip technologies) |
10.3.4. |
Electric vehicle battery heaters (IEE) |
10.3.5. |
Where PTC inks can be used in vehicles? |
10.4. |
Metal sintering die attach in electric vehicle power electronics |
10.4.1. |
Power electronics in electric vehicles |
10.4.2. |
Power switch technology: a generational shift towards SiC and GaN |
10.4.3. |
Benchmarking Si vs SiC vs GaN |
10.4.4. |
SiC and GaN still have substantial room to improve |
10.4.5. |
Where will GaN and SiC win? |
11. |
TOWARDS HIGHER AREA POWER DENSITY AND HIGHER OPERATING TEMPERATURES |
11.1. |
Mega trend in power modules: increasing power density |
11.2. |
Operation temperature increasing |
11.3. |
Roadmap towards lower thermal resistance |
11.4. |
Traditional packaging technology |
12. |
REVIEW OF PACKAGING APPROACHES IN ELECTRIC VEHICLES |
12.1. |
Toyota Prius (2004-2010): power module |
12.2. |
2008 Lexus power module |
12.3. |
Toyota Prius (2010-2015): power module |
12.4. |
Toyota Prius (2016 onwards): power module |
12.5. |
Chevrolet 2016 Power module (by Delphi) |
12.6. |
Cadillac 2016 power module (by Hitachi) |
12.7. |
Nissan Leaf power module (2012) |
12.8. |
Honda Accord 2014 Power Module |
12.9. |
Honda Fit (by Mitsubishi) |
12.10. |
BWM i3 (by Infineon) |
12.11. |
Infineon: evolution of HybridPack and beyond |
12.12. |
Infineon's HybridPack is used by multiple producers (SAIC, Hyundai, etc.) |
12.13. |
Tesla Mode S (discreet IGBT) and Model 3 (SiC module) |
13. |
BEYOND SOLDER: MATERIALS AND TECHNOLOGY TO SUSTAIN ROADMAP TOWARDS HIGHER TEMPERATURES |
13.1. |
Die and substrate attach are common failure modes in power devices |
13.2. |
Die attach technology trend |
13.3. |
The choice of solder technology |
13.4. |
Why metal sintering? |
13.5. |
Sintering can be used at multiple levels (die-to-substrate, substrate-baseplate or heat sink, die pad to interconnect, etc) |
13.6. |
Transition towards Ag sintering (Tesla 3 with ST SiC modules) |
14. |
METAL SINTERING DIE ATTACH PASTE SUPPLIERS |
14.1. |
Pressured Ag sintered pastes: key characteristics |
14.2. |
Sintering and pick-and-place machines |
14.3. |
ASM SilverSAM: integrating sintering machine |
14.4. |
Process steps for applying Ag sintered paste |
14.5. |
Using film or preform vs paste |
14.6. |
Using IR oven to speed up the process |
14.7. |
Effect of time, pressure, and temperature on joint strength |
14.8. |
Pressure-less Ag sintered pastes: key characteristics |
14.9. |
Effect of substrate metallization on sintered joint shear strength |
14.10. |
Suppliers of Ag sintered paste |
14.11. |
Alpha: commercializing Ag nano sintering die attach paste |
14.12. |
Heraeus: sintered Ag die attach paste |
14.13. |
Dowa: nano Ag sintered die attach paste |
14.14. |
Namics: Low temperature die attach Ag conductive paste |
14.15. |
Namics: a variety of Ag die attach paste |
14.16. |
Kyocera: mixed nano/micro pressure-less sintering die attach paste |
14.17. |
Mitsubishi Materials: low temperature die attach Ag conductive paste |
14.18. |
Henkel: Ag sintering paste |
14.19. |
Toyo Chem: Sintered die attach paste |
14.20. |
Bando Chemical: pressure-less nano Ag sintering paste |
14.21. |
Amo Green: pressure-less nano Ag sintering paste |
14.22. |
Other Ag nanoparticle sintered die attach paste suppliers (e.g., Bando and NBE Tech) |
14.23. |
Nihon Hanada: Pressureless sintering |
14.24. |
Heraeus and Nihon Handa cross license |
14.25. |
Indium Corp: nano Ag pressureless sinter paste |
14.26. |
Nihon Superior: nano silver for sintering |
14.27. |
Hitachi: Cu sintering paste |
14.28. |
Cu sintering: characteristics |
14.29. |
Reliability of Cu sintered joints |
14.30. |
Mitsui Mining: Nano copper pressured and pressure-less sintering under N2 environment |
14.31. |
Transient liquid phase sintering: mid-level performance alternative? |
14.32. |
SMIC: incumbent solder supplier |
14.33. |
Some price info on Ag sintering, solder and TLPB |
15. |
LTCC IN AUTOMOTIVE |
15.1.1. |
LTCC: introduction and process details |
15.1.2. |
LTCC: application examples in automotive electronics |
15.1.3. |
Properties of main LTCC substrates |
15.1.4. |
Sintering profile of typical LTCC pastes |
15.1.5. |
EMI shielding in electric vehicle plastic or composite battery housings |
15.1.6. |
Electrochromic mirrors in vehicles |
15.2. |
Towards mmwave 5G filters: will LTCC win the race? |
15.2.1. |
Evolution of filters towards sub-6GHz 5G and mmWave |
15.2.2. |
Performance requirements |
15.2.3. |
Size requirements |
16. |
INCUMBENT TECHNOLOGY: SAW AND BAW TECHNOLOGY |
16.1. |
SAW and BAW filters |
16.2. |
More on BAW filters |
16.3. |
SAW and BAW: fit for 5G and beyond? |
17. |
WAVEGUIDE TECHNOLOGY |
17.1. |
Metallic waveguide technology: high performance but too big |
17.2. |
Waveguide filters |
18. |
SUBSTRATE INTEGRATED WAVEGUIDE FILTERS (SIW) |
18.1. |
Substrate integrated waveguide filters (SIW) |
19. |
SINGLE-LAYER TRANSMISSION-LINE FILTERS ON PCB OR CERAMICS |
19.1. |
Transmission-line filters: single-layer microstrip PCB |
19.2. |
Single-layer microstrip PCB: tolerance sensitivity |
19.3. |
Transmission-line filters: single-layer stripline PCB |
19.4. |
Single-layer stripline PCB: tolerance sensitivity |
19.5. |
Transmission-line filters: single-layer thin film metallized ceramic filters as SMTs |
19.6. |
High-k ceramics |
19.7. |
Filters with thick film substrates |
19.8. |
Glass: an excellent filter substrate? |
19.9. |
Glass-based single-layer transmission-line filters |
20. |
MULTI-LAYER LTTC-BASED FILTERS |
20.1. |
NGK: multi-layer LTTC-based filters |
20.2. |
TDK: multi-layer 28GHz LTCC filter |
20.3. |
Kyocera: multi-layer 28GHz LTCC filter |
20.4. |
Minicircuits: multilayer LTCC filter |
20.5. |
Multilayer LTCC: production challenge |
21. |
CONCLUSIONS |
21.1. |
Benchmarking different mmwave filters |
22. |
SINTERED DIE ATTACH OR EPOXY IN 5G RF POWER AMPLIFIERS? |
22.1.1. |
Motivation of 5G: increasing the bandwidth |
22.1.2. |
5G station installation forecast by frequency |
22.2. |
Overview of RF power amplifier technologies |
22.2.1. |
The choice of the semiconductor technology |
22.2.2. |
Key semiconductor properties |
22.2.3. |
Key semiconductor technology benchmarking |
22.2.4. |
The choice of the semiconductor technology |
22.2.5. |
Power vs frequency map of power amplifier technologies |
22.2.6. |
LDMOS dominates but will struggle to reach even sub-6GHz 5G |
22.2.7. |
GaAs vs GaN for RF power amplifiers |
22.2.8. |
GaN to win in sub-6GHz 5G |
22.2.9. |
The situation at mmwave 5G can drastically different |
22.2.10. |
Solving the power challenge: high antenna gain increases distance |
22.2.11. |
Shift to higher frequencies shrinks the antenna |
22.2.12. |
Major technological change: from broadcast to directional communication |
22.2.13. |
Which power amplifier technology to win in mmwave 5G? |
22.3. |
Current and future die attach: role of metal sintering or filled epoxy |
22.3.1. |
Air cavity vs plastic overmold packages |
22.3.2. |
Packaging LDMOS power amplifiers |
22.3.3. |
Packaging GaN power amplifiers |
22.3.4. |
Benchmarking CTE and thermal conductivity of various packaging materials |
22.3.5. |
HTCC metal-ceramic package |
22.3.6. |
LTCC RF transitions in packages |
22.3.7. |
Current die attach technology choice for RF GaN PAs |
22.3.8. |
Current die attach technology choice for RF GaN PAs |
22.3.9. |
Emerging die attach technology choice for RF GaN PAs |
22.3.10. |
Properties of Ag sintered or epoxy die attach materials |
22.3.11. |
Automating the die attach for 5G power amplifiers |
22.3.12. |
Board-level heat dissipation: thermal interface materials |
22.3.13. |
Indium foils as a good board-level TIM option |
22.3.14. |
Built-in Cu slugs in GaN packages |
23. |
SKIN PATCHES |
23.1. |
Product areas with body-worn electrodes |
23.2. |
Printed electronics in cardiac skin patches |
23.3. |
Cardiac skin patch types: Flexible patch with integrated electrodes |
23.4. |
Skin patches for inpatient monitoring |
23.5. |
General patient monitoring: a growing focus |
23.6. |
Chemical sensing in sweat |
23.7. |
VivaLNK |
23.8. |
DevInnova / Scaleo Medical |
23.9. |
US Military head trauma patch / PARC |
23.10. |
Wound monitoring and treatment |
23.11. |
Nissha GSI Technologies |
23.12. |
Printed wearable medical sensors (examples) |
23.13. |
Opportunity for printed electronics by type of skin patch |
23.14. |
Electrode types |
23.15. |
Printed functionality in skin patches. |
23.16. |
Blue Spark |
23.17. |
DevInnova / Scaleo Medical |
23.18. |
Novii: Wireless fetal heart rate monitoring |
23.19. |
Wearable ECG sensor from VTT |
23.20. |
Quad Industries - developing healthcare |
24. |
CONFORMAL METALLIZATION (LDS, AEROSOL PRINTING, AND OTHER PRINTING) |
24.1.1. |
Conformal coating: increasingly popular |
24.1.2. |
Conformal printing in consumer electronics |
24.1.3. |
Conformal electronics: rapid turn-around with little tooling costs |
24.1.4. |
Laser Direct Structuring and MID: introduction |
24.1.5. |
Laser Direct Structuring and MID: example in cosumer electronics |
24.1.6. |
Examples of LDS products on the market |
24.1.7. |
Observations on the MID market |
24.2. |
Aerosol deposition |
24.2.1. |
Aerosol deposition: introduction |
24.2.2. |
What is aerosol deposition |
24.2.3. |
Aerosol deposition can go 3D |
24.2.4. |
Aerosol deposition: applications |
24.2.5. |
Aerosol deposition is already in commercial use |
24.2.6. |
Applications of aerosol beyond antennas |
24.2.7. |
Aerosol deposition vs LDS (laser direct structuring) |
24.2.8. |
Ink requirements for aerosol printing |
24.2.9. |
Others ways of printing structurally-integrated antennas |
24.3. |
Ink-based conformable package-level EMI shielding |
24.3.1. |
What is package-level EMI shielding |
24.3.2. |
Conformal coating: increasingly popular |
24.3.3. |
EMI shielding |
24.3.4. |
EMI shielding films: price and performance level |
24.3.5. |
EMI shielding market: an approximate estimate |
24.3.6. |
Why conformal EMI shielding? |
24.3.7. |
What is package-level EMI shielding? |
24.3.8. |
Has package-level shielding been adopted? |
24.3.9. |
Which suppliers and elements have used EMI shielding? |
24.3.10. |
What is the incumbent process? |
24.3.11. |
Screen printed EMI shielding: process and merits |
24.3.12. |
Spray-on EMI shielding: process and merits |
24.3.13. |
Suppliers targeting ink-based conformal EMI shielding |
24.3.14. |
Henkel: performance of EMI ink |
24.3.15. |
Duksan: performance of EMI ink |
24.3.16. |
Ntrium: performance of EMI ink |
24.3.17. |
Clariant: performance of EMI ink |
24.3.18. |
Fujikura Kasei: performance of EMI ink |
24.3.19. |
Spray machines used in conformal EMI shielding |
24.3.20. |
Particle size and morphology choice |
24.3.21. |
Ink formulation challenges: thickness and Ag content |
24.3.22. |
Ink formulation challenges: sedimentation prevention |
24.3.23. |
Emi shielding: inkjet printed particle-free Ag inks |
24.3.24. |
Agfa: EMI shielding prototype |
24.3.25. |
Has there been commercial adoption of ink-based solutions? |
24.3.26. |
Compartmentalization of complex packages is a key trend |
24.3.27. |
The challenge of magnetic shielding at low frequencies |
24.3.28. |
Value proposition for magnetic shielding using printed inks |
25. |
IN-MOLD ELECTRONICS |
25.1.1. |
Introduction to in-mold electronics (IME)? |
25.1.2. |
Commercial advantages and challenges of IME |
25.1.3. |
The route to commercialisation |
25.1.4. |
Overview of key players across the supply chain |
25.1.5. |
IME market forecast - application |
25.1.6. |
Benchmarking competitive processes to 3D electronics |
25.1.7. |
IME: 3D friendly process for circuit making |
25.1.8. |
What is the in-mold electronic process? |
25.1.9. |
In-Mold Electronics production: required equipment set |
25.1.10. |
In-Mold Decoration production: required equipment set |
25.2. |
Conductive ink requirements for IME |
25.2.1. |
IME: value transfer from PCB board to ink |
25.2.2. |
New ink requirements: stretchability |
25.2.3. |
Stretchable conductive ink suppliers multiply |
25.2.4. |
IME conductive ink suppliers multiply |
25.2.5. |
Evolution and improvements in performance of stretchable conductive inks |
25.2.6. |
Performance of stretchable conductive inks |
25.2.7. |
Bridging the conductivity gap between printed electronics and IME inks |
25.2.8. |
The role of particle size in stretchable inks |
25.2.9. |
Elantas: selecting right fillers and binders to improve stretchability |
25.2.10. |
E2IP Technologies/GGI Solutions: particle-free IME inks |
25.2.11. |
The role of resin in stretchable inks |
25.2.12. |
New ink requirements: portfolio approach |
25.2.13. |
Diversity of material portfolio |
25.2.14. |
All materials in the stack must be compatible: conductivity perspective |
25.2.15. |
All materials in the stack must be compatible: forming perspective |
25.2.16. |
New ink requirements: surviving heat stress |
25.2.17. |
New ink requirements: stability |
25.2.18. |
All materials in the stack must be reliable |
25.2.19. |
Design: general observations |
25.2.20. |
SMD assembly: before or after forming |
25.2.21. |
The need for formable conductive adhesives |
25.3. |
Overview of applications, commercialization progress, and prototypes |
25.3.1. |
In-Mold electronic application: automotive |
25.3.2. |
HMI: trend towards 3D touch surfaces |
25.3.3. |
Addressable market in vehicle interiors in 2020 and 2025 |
25.3.4. |
Automotive: In-Mold Decoration product examples |
25.3.5. |
White goods, medical and industrial control (HMI) |
25.3.6. |
White goods: In-Mold Decoration product examples |
25.3.7. |
Is IME commercial yet? |
25.3.8. |
First (ALMOST) success story: overhead console in cars |
25.3.9. |
Commercial products: wearable technology |
25.3.10. |
Automotive: direct heating of headlamp plastic covers |
25.3.11. |
System integrates electronics |
25.3.12. |
Automotive: human machine interfaces |
25.3.13. |
GEELY Seat Control |
25.3.14. |
Faurecia concept: prototype to test functionality |
25.3.15. |
Faurecia concept: traditional vs. IME design |
25.3.16. |
Increasing number of research prototypes |
25.3.17. |
Consumer electronics prototypes to products |
25.3.18. |
White goods: human machine interfaces |
25.3.19. |
Antennas |
25.3.20. |
Consumer electronics and home automation |
25.3.21. |
Home automation becomes commercial |
25.3.22. |
IME market forecast - application |
25.3.23. |
Ten-year in-mold-electronics market forecast in area |
25.3.24. |
Estimate of value capture by different elements in an IME product |
25.3.25. |
Ten-year market forecasts for functional inks in IME |
26. |
STRETCHABLE INKS (E-TEXTILES MOSTLY) |
26.1. |
Introduction to the e-textile industry |
26.1.1. |
Timeline: Historic context for e-textiles |
26.1.2. |
Timeline: Commercial beginnings and early growth |
26.1.3. |
Timeline: A boom in interest, funding and activity |
26.1.4. |
Timeline: Challenges emerge from the optimism |
26.1.5. |
Addressing industry challenges |
26.1.6. |
Timeline: Present day and outlook |
26.1.7. |
Commercial progress with e-textile projects |
26.1.8. |
E-textile product types |
26.1.9. |
Revenue in e-textiles, by market sector |
26.1.10. |
Materials usage in e-textiles |
26.1.11. |
Example suppliers for each material type |
26.2. |
Stretchable conductive inks for e-textiles |
26.2.1. |
Inks and Encapsulation |
26.2.2. |
Stretchable e-textile conductive inks: introduction |
26.2.3. |
Stretchable e-textile conductive inks: performance requirements |
26.2.4. |
Performance characteristics of conductive by Panasonic, Nagase, Fujikura Kasei |
26.2.5. |
Performance characteristics of conductive by Namics, Toyobo, Jujo Chemical, etc. |
26.2.6. |
Performance characteristics of conductive by Polymatech, Cemedine, Henkel, DuPont, etc. |
26.2.7. |
Stretchable conductive inks: continuous improvement in performance |
26.2.8. |
Stretchable conductive inks: the role of particle size |
26.2.9. |
Stretchable conductive inks: the role of particle size |
26.2.10. |
Stretchable conductive inks: the role of pattern design |
26.2.11. |
Washability of stretchable conductive inks |
26.2.12. |
Stretchable conductive inks: the role of encapsulants |
26.2.13. |
Other TPU alternatives: Showa Denko, Osaka Industry, Nikkan Industry, etc. |
26.2.14. |
Stretchable conductive inks: the role of encapsulants |
26.2.15. |
Stretchable conductive inks: the role of substrates |
26.2.16. |
Stretchable conductive inks: the role of the resin |
26.2.17. |
Graphene as a stretchable e-textile conductive ink |
26.2.18. |
Graphene inks are not very conductive |
26.2.19. |
PEDOT as a conductive e-textile material |
26.2.20. |
Not limited to just Ag inks |
26.3. |
Applications of stretchable conductive inks for e-textiles |
26.3.1. |
An explosion in ink suppliers for e-textiles |
26.3.2. |
E-textile products with conductive inks |
26.3.3. |
DuPont |
26.3.4. |
Toyobo |
26.3.5. |
Inks are not the only solution |
26.4. |
Stretchable conductive inks in flexible and/or stretchable circuit boards |
26.4.1. |
Stretchable circuit boards: limitations of FPCBs |
26.4.2. |
Stretchable conductive inks in FPCBs |
26.4.3. |
Stretchable circuit boards |
26.4.4. |
Printed stretchable interconnects |
27. |
PRINTING RFID ANTENNAS |
27.1.1. |
Different varieties of RFID |
27.1.2. |
RFID tags: unit sales forecast for LF, HF, and UHF |
27.1.3. |
RFID Range versus cost |
27.1.4. |
Passive RFID: Technologies by Operating Frequency |
27.1.5. |
Anatomy of passive HF and UHF tags |
27.1.6. |
Challenges in contacting HF/NFC coils |
27.1.7. |
Antenna Technology Choices |
27.1.8. |
Antenna Manufacturing Technologies: Comparison Table |
27.1.9. |
Passive RFID price teardown, HF and UHF |
27.1.10. |
RFID Antennas: New Technologies |
27.2. |
Printed RFID antenna: progress, status, challenges, and innovation |
27.2.1. |
Bill of material is high for printed RFID |
27.2.2. |
But why are some RFID antennas already printed? |
27.2.3. |
Example of printed RFID antenna |
27.2.4. |
YFY: a major RFID antenna printer using high-speed flex printing |
27.2.5. |
R2R direct printing with normal heat curing |
27.2.6. |
Innovations to eliminate printed BoM and to speed up curing/sintering times |
27.2.7. |
End user feedback about recent innovations |
27.2.8. |
R2R direct printing with normal heat curing |
27.2.9. |
High conductivity copper inks with rapid sintering |
27.2.10. |
Direct physical pattering |
27.2.11. |
Rapid sintering of copper ink |
27.3. |
Transparent antenna |
27.3.1. |
Printed or Printed-and-Plate high conductivity transparent antennas |
27.3.2. |
Ten-year market projections for conductive inks in UHF and HF RFID antennas |
28. |
INTRODUCTION TO FLEXIBLE HYBRID ELECTRONICS |
28.1.1. |
Defining flexible hybrid electronics (FHE) |
28.1.2. |
FHE Examples: Combing conventional components with flexible/printed electronics on flexible substrates |
28.1.3. |
FHE: The best of both worlds? |
28.1.4. |
Overcoming the flexibility/functionality compromise |
28.1.5. |
Commonality with other electronics methodologies |
28.1.6. |
Enabling technologies for FHE |
28.1.7. |
Transition from PI to cheaper substrates |
28.1.8. |
Low temperature component attachment |
28.1.9. |
Development of flexible ICs |
28.1.10. |
OFETs offer insufficient processing capability |
28.1.11. |
Thinning silicon wafers for flexibility. |
28.1.12. |
Silicon on polymer technology |
28.1.13. |
Thin Si processing steps |
28.1.14. |
Example flexible IC capabilities |
28.1.15. |
Flexible silicon chip comparison |
28.1.16. |
Assembling FHE circuits |
28.1.17. |
Pick-and-place challenges |
28.1.18. |
Multicomponent R2R line |
28.2. |
Conductive ink-based attachment in flexible hybrid electronics (FHE) |
28.2.1. |
Low temperature solder enables thermally fragile substrates |
28.2.2. |
Substrate compatibility with existing infrastructure |
28.2.3. |
Low temperature soldering |
28.2.4. |
Photonic soldering: A step up from sintering |
28.2.5. |
Photonic soldering: Substrate dependence. |
28.2.6. |
Electrically conductive adhesives: Two different approaches |
28.2.7. |
Conductive paste bumping on flexible substrates |
28.2.8. |
Ag pasted for die attachment. |
28.3. |
Conductive ink-based metallization in flexible hybrid electronics (FHE) |
28.3.1. |
Ag pasted for die attachment. |
28.3.2. |
Narrow linewidth metallization in flexible hybrid electronics |
29. |
TOUCH SCREEN EDGE ELECTRODES |
29.1. |
Touch screen: where and why pastes are used |
29.2. |
Touch screen: narrow bezels change the market |
29.3. |
Touch screen: adopting to narrow linewidth requirements |
29.4. |
Laser cut paste: hybrid approach towards ultra narrow lines |
29.5. |
Photopatternable paste: hybrid approach towards ultra narrow lines |
29.6. |
Laser cut vs photopatternable inks |
29.7. |
Other printing process towards narrow edge electrodes |
29.8. |
Background to the PCB industry |
29.9. |
Example of boards |
29.10. |
Breakdown of the PCB market by the number of layers |
29.11. |
Traditional PCBs are a mature technology |
29.12. |
Production steps involved in manufacturing a multi-layer PCB. |
29.13. |
PCB market by production territory |
29.14. |
IP and turn-around time issues |
29.15. |
CNC machine create double-sided rigid PCB. |
29.16. |
'Printing' PCBs for the hobbyist and DIY market: examples |
29.17. |
Integrated desktop PCB printer and pick-and-place machine |
29.18. |
'Printing' professional multi-layer PCBs |
29.19. |
Print seed and plate approach |
29.20. |
Printing etch resists in PCB production |
29.21. |
Progress on seed-and-plate PCBs |
29.22. |
Comparison of different PCB techniques |
30. |
ITO REPLACEMENT |
30.1. |
ITO film assessment: performance, manufacture and market trends |
30.2. |
ITO film shortcomings: flexibility |
30.3. |
ITO film shortcomings: limited sheet conductivity |
30.4. |
ITO film shortcomings: limited sheet resistance |
30.5. |
ITO film shortcomings: index matching |
30.6. |
ITO film shortcomings: thinness |
30.7. |
ITO film shortcomings: price falls and commoditization |
30.8. |
ITO films: current prices (2018) |
30.9. |
Indium's single supply risk: real or exaggerated? |
30.10. |
Recycling comes to the rescue? |
30.11. |
Indium: price fluctuations drive innovation |
30.12. |
Metal mesh: photolithography followed by etching |
30.13. |
Fujifilm's photo-patterned metal mesh TCF |
30.14. |
Toppan Printing's copper mesh transparent conductive films |
30.15. |
Panasonic's Large Area Metal Mesh |
30.16. |
GiS (integrator): Large area metal mesh displays |
30.17. |
Panasonic's Large Area Metal Mesh |
30.18. |
GiS (integrator): Large area metal mesh displays |
31. |
EMBOSSING FOLLOWED BY PRINTING/FILLING TO CREATE IMBEDDED ULTRAFINE METAL MESH? |
31.1.1. |
Embossing/imprinting metal mesh TCFs |
31.1.2. |
O-Film's metal mesh TCF technology: the basics |
31.1.3. |
Will O-Film rejuvenate its metal mesh business after disappointing sales? |
31.1.4. |
MNTech's metal mesh TCF technology (the incident) |
31.1.5. |
J-Touch: substantial metal mesh capacity |
31.1.6. |
Nanoimprinting metal mesh with 5um linewidth |
31.1.7. |
Metal mesh TCF is flexible |
31.2. |
Direct printing: finally making a comeback in metal mesh TCF as a viable ultrafine technology? |
31.2.1. |
Direct printed metal mesh transparent conductive films: performance |
31.2.2. |
Direct printed metal mesh transparent conductive films: major shortcomings |
31.2.3. |
Komura Tech: improvement in gravure offset printed fine pattern (<5um) metal mesh TCF ? |
31.2.4. |
Shashin Kagaku: offset printed metal mesh TCF |
31.2.5. |
Komori: gravure offset all-printed metal mesh film? |
31.2.6. |
Asahi Kasei: taking steps to commercialize its R2R ultrafine printing process |
31.2.7. |
How is the ultrafine feature R2R mold fabricated? |
31.2.8. |
Konica Minolta: inkjet printing large area fine pitch metal mesh TCFs with <10um linewidth? |
31.2.9. |
Gunze: S2S screen printing finds a market fit? |
31.2.10. |
Toray's photocurable screen printed paste for fine line metal mesh |
31.2.11. |
Ishihara Chemical's gravure printed photo-sintered Cu paste |
31.2.12. |
Toppan Forms: Ag salt inks to achieve 4um printed metal mesh? |
32. |
PRINT AND PLATE |
32.1. |
Eastman Kodak: Transparent ultra low-resistivity RF antenna using printed Cu metal mesh technology |
32.2. |
Kuroki/ITRI: printed seed layer and plate Cu metal mesh? |
33. |
REPLACING PHOTOLITHOGRAPHY WITH PHOTORESIST PRINTING FOR ULTRA FINE METAL MESH |
33.1. |
Replacing photolithography with photoresist printing for ultra fine metal mesh |
33.2. |
LCY gravure printing photoresist then etching |
33.3. |
Screen Holding: gravure printing photoresist then etching |
33.4. |
Consistent Materials' photoresist for metal mesh |
33.5. |
Tanaka Metal's metal mesh technology |
34. |
OLED LIGHTING |
34.1. |
OLED lighting: solid-state, efficient, cold, surface emission, flexible......? |
34.2. |
Performance challenge set by the incumbent (inorganic LED) |
34.3. |
Cost challenge set by the incumbent (inorganic LED) |
34.4. |
Lighting is more challenging than display? |
34.5. |
Status of performance of rigid and flexible sheet to sheet OLED lighting |
34.6. |
OLED lighting: key avenues of differentiations vs LED |
34.7. |
Will OLED lighting ever take off? |
34.8. |
How are conductive inks to be used in OLED lighting |
34.9. |
Light Emitting Electrochemical Cell (LEC): printed or air sprayed coating polymeric light |
34.10. |
Light Emitting Electrochemical Cell (LEC): printed or air sprayed coating polymeric light |
35. |
PRINTED PIEZORESISTIVE SENSORS |
35.1. |
Force sensing resistors |
35.2. |
Two constructions for force sensors |
35.3. |
Printed piezoresistive sensors: anatomy |
35.4. |
Printed piezoresistive sensor |
35.5. |
Printed means various sizes possible |
35.6. |
Materials |
35.7. |
Complete Material Portfolio Approach is Common |
35.8. |
Customizing Performance |
35.9. |
Previous applications of FSR |
35.10. |
Medical applications of printed FSR |
35.11. |
Automotive applications of printed FSR |
35.12. |
Consumer electronic applications of printed FSR |
35.13. |
Textile-based applications of printed FSR |
35.14. |
SOFTswitch: force sensor on fabric |
35.15. |
Large-area pressure sensors |
35.16. |
Printed foldable force sensing solution |
35.17. |
Printed foldable force sensing solution |
35.18. |
Ten-year market projections for piezoresistive sensors at the device level |
36. |
PRINTED PIEZOELECTRIC SENSORS |
36.1. |
Piezoelectric sensors |
36.2. |
PVDF and related materials |
36.3. |
PVDF-based polymer options for sensing and haptic actuators |
36.4. |
Low temperature piezoelectric inks |
36.5. |
Piezoelectric Polymers |
36.6. |
Printed piezoelectric sensor |
36.7. |
Printed piezoelectric sensors: prototypes |
36.8. |
Applications: Loudspeaker |
36.9. |
Applications: Haptic actuators |
36.10. |
Example application: Haptic gloves |
36.11. |
Printed Piezoelectric Sensors: Market Forecasts |
36.12. |
High-strain sensors (capacitive) |
36.13. |
Use of dielectric electroactive polymers (EAPs) |
36.14. |
Printed capacitive stretch sensors |
36.15. |
Players with EAPs: Parker Hannifin |
36.16. |
Applications: Strain sensor |
36.17. |
Players with EAPs: Stretchsense |
36.18. |
Players with EAPs: Bando Chemical |
36.19. |
C Stretch Bando: Progress on stretchable sensors |
36.20. |
Other force sensors (capacitive & resistive) |
36.21. |
Force sensor examples: Polymatech |
36.22. |
Force sensor examples: Sensing Tex |
36.23. |
Force sensor examples: Vista Medical |
36.24. |
Force sensor examples: InnovationLab |
36.25. |
Force sensor examples: Tacterion |
36.26. |
Force sensor example: Yamaha and Kureha |
36.27. |
Force sensor examples: BeBop Sensors |
37. |
DIABETES |
37.1.1. |
Diabetes on the rise |
37.1.2. |
Managing side effects accounts for 90% of the total cost of diabetes |
37.1.3. |
Diabetes management process |
37.1.4. |
Diabetes management device roadmap: Glucose sensors |
37.2. |
Incumbent technology for glucose testing: the test strip |
37.2.1. |
Anatomy of a typical glucose test strip |
37.2.2. |
Benchmarking printing vs. sputtering in glucose test strip product |
37.2.3. |
Manufacturing steps of a typical glucose test strip |
37.2.4. |
Materials used in glucose test strips |
37.2.5. |
Glucose test strips: price pressure |
37.3. |
Emerging options: continuous monitoring of glucose levels |
37.3.1. |
Connected and Smartphone-based Glucometers |
37.3.2. |
The case for CGM |
37.3.3. |
Skin patches are the form factor of choice |
37.3.4. |
CGM: Overview of key players |
37.3.5. |
Implantable glucose sensors: Introduction |
37.3.6. |
Key Players in Implantable Glucose Monitoring |
37.3.7. |
Focus shifts from test strips to CGM |
37.3.8. |
Strategy comparison amongst the largest players |
38. |
PRINTED THIN FILM TRANSISTORS |
38.1. |
Printed TFTs aimed to enable simpler processing |
38.2. |
Technical challenges in printing thin film transistors |
38.3. |
Organic semiconductors for TFTs |
38.4. |
Organic transistor materials |
38.5. |
OTFT mobility overestimation |
38.6. |
Merck's Organic TFT |
38.7. |
Printed logic for RFID |
38.8. |
S2S automatic printed OTFT |
38.9. |
Roll-to-roll printed organic TFTs |
38.10. |
Commercial difficulties with printed transistors |
38.11. |
Fully printed ICs for RFID using CNTs. |
38.12. |
MoOx semiconductors: Advantages and disadvantages |
38.13. |
Metal oxide semiconductor production methods |
38.14. |
Evonik's solution processible metal oxide |
38.15. |
IGZO TFTs room temperature with deep UV annealing |
39. |
PRINTED MEMORY |
39.1. |
Printed memory: a dead technology? |
39.2. |
Applications of printed thin film memory |
39.3. |
The structure of printed memory and the role of printed conductors |
39.4. |
Challenges in rapid printing of polymeric memories |
40. |
3D PRINTED ELECTRONICS |
40.1. |
Printed wearable medical sensors (examples) |
40.2. |
3D printed plastics: many materials are used |
40.3. |
Progress in 3D printed electronics: company examples |
40.4. |
Especially formulated inks for 3D printed electronics |
40.5. |
Ink requirements for 3D printed electronics |
40.6. |
Market forecasts |
40.7. |
Why large-area LED array lighting |
40.8. |
Examples of LED array lighting |
40.9. |
Role of conductive inks in large-area LED arrays |
40.10. |
Printed LED lighting |
40.11. |
Nth Degree - Printed LEDs |
40.12. |
Competitive non-printed approach to making the base for large-area LED arrays |
41. |
CONDUCTIVE PENS |
41.1. |
Conductive pens based on particle-free inks |
41.2. |
Conductive pens based on particle-based inks |
42. |
MOBILE PHONE DIGITIZERS |
42.1. |
Mobile phone digitizers |
42.2. |
Value chain for printed digitizers |
42.3. |
Using photo sintered Cu for digitizers? |
43. |
E-READERS |
43.1. |
Printed display back circuit for flexible e-readers |